高纵横比PCB解决方案之脉冲电镀—Shenzhen Bega Electronic Materials Co., Ltd.

Contact TOP

电话联系

产品优势介绍

高纵横比PCB解决方案之脉冲电镀

01: 优异的镀铜均匀性和高纵横比深镀能力。
02: 镀层结晶细致，可靠性高。
03: 电镀效率高，可提升生产效率,降低生产成本.
04: 针对龙门式和VCP设备提供专业的电镀方案。
05: 作业宽松，槽液易管控。

产品表现

Related Products

PCB Chemicals: Hole metallization; Plating; Surface treatment; Copper surface treatment; Other products

FPC Chemicals: Hole metallization; Plating; Surface treatment; Copper surface treatment; Other products

R & D: Testing Center; Quality Assurance; Technical Papers

News: Company News; Industry News

About us: Company Profile; Company Culture; Honor; Development History; Partnership; Service Network

Contact us: Recruitment

National Advisory Hotline

South China：0755-26966702

East China：0512-55193498
0512-57911269

©2019Shenzhen Bega Electronic Materials Co., Ltd.

Internet Brand Services:CTM

Sitemap |