高端化铜解决方案之垂直沉铜—Shenzhen Bega Electronic Materials Co., Ltd.

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高端化铜解决方案之垂直沉铜

01: 优秀的盲孔及高纵横比通孔品质表现。
02: 良好的槽液稳定性。
03: 镀层覆盖能力好, 适用于各种特殊板材制作。
04: 镀层可靠性优异, 可通过严格的信赖性测试。
05: 镀层致密，具有良好的结合力。

制程能力

除胶效果 Desmear performance

背光测试 Backlight Test

信赖性测试 Reliablity Test (热冲击测试Thermal Shock Test : 288°C, 10sec, 6 cycles )

PCB Chemicals: Hole metallization; Plating; Surface treatment; Copper surface treatment; Other products

FPC Chemicals: Hole metallization; Plating; Surface treatment; Copper surface treatment; Other products

R & D: Testing Center; Quality Assurance; Technical Papers

News: Company News; Industry News

About us: Company Profile; Company Culture; Honor; Development History; Partnership; Service Network

Contact us: Recruitment

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South China：0755-26966702

East China：0512-55193498
0512-57911269

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