高端化铜解决方案之水平沉铜—Shenzhen Bega Electronic Materials Co., Ltd.

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高端化铜解决方案之水平沉铜

01: 微小孔及盲孔金属化制程。
02: 制程稳定,设备自动化。
03: 镀层应力低,可靠性佳。
04: 作业环境安全环保。
05: 反应时间短,可提高生产效率。

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PCB Chemicals: Hole metallization; Plating; Surface treatment; Copper surface treatment; Other products

FPC Chemicals: Hole metallization; Plating; Surface treatment; Copper surface treatment; Other products

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Contact us: Recruitment

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South China：0755-26966702

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0512-57911269

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