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产品优势介绍
高纵横比PCB解决方案之脉冲电镀
01: 优异的镀铜均匀性和高纵横比深镀能力。
02: 镀层结晶细致,可靠性高。
03: 电镀效率高,可提升生产效率,降低生产成本.
04: 针对龙门式和VCP设备提供专业的电镀方案。
05: 作业宽松,槽液易管控。
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Hole metallization
Plating
Surface treatment
Copper surface treatment
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Hole metallization
Plating
Surface treatment
Copper surface treatment
Other products
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Industry News
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Company Culture
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